Principles of Plasma Discharges and Materials Processing

(Timely, authoritative, pedagogically consistent— a valuab...)

Timely, authoritative, pedagogically consistent— a valuable professional resource and a superior didactic tool. Authored by two internationally respected pioneers in the field, this book offers a fully integrated, pedagogically consistent presentation of the fundamental physics and chemistry of partially ionized, chemically reactive, low-pressure plasmas and their roles in a wide range of plasma discharges and processes used in thin film processing applications—especially in the fabrication of integrated circuits. With many fully worked examples, practice exercises, and clear demonstrations of the relationship of plasma parameters to external control parameters and processing results, this book combines the best qualities of a student text and a professional resource. • In-depth coverage of the fundamentals of plasma physics and chemistry—includes separate chapters on atomic and molecular collisions • Applies basic theory to plasma discharges, including calculations of plasma parameters and scaling of plasma parameters with control parameters • Applies results to basic processing mechanisms and the effects of plasma parameters on those mechanisms • Uses numerous worked examples to demonstrate the relationships between control parameters, plasma parameters, and processing results

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Principles of Plasma Discharges and Materials Processing , 2nd Edition

(A Thorough Update of the Industry Classic on Principles o...)

A Thorough Update of the Industry Classic on Principles of Plasma Processing The first edition of Principles of Plasma Discharges and Materials Processing, published over a decade ago, was lauded for its complete treatment of both basic plasma physics and industrial plasma processing, quickly becoming the primary reference for students and professionals. The Second Edition has been carefully updated and revised to reflect recent developments in the field and to further clarify the presentation of basic principles. Along with in-depth coverage of the fundamentals of plasma physics and chemistry, the authors apply basic theory to plasma discharges, including calculations of plasma parameters and the scaling of plasma parameters with control parameters. New and expanded topics include: * Updated cross sections * Diffusion and diffusion solutions * Generalized Bohm criteria * Expanded treatment of dc sheaths * Langmuir probes in time-varying fields * Electronegative discharges * Pulsed power discharges * Dual frequency discharges * High-density rf sheaths and ion energy distributions * Hysteresis and instabilities * Helicon discharges * Hollow cathode discharges * Ionized physical vapor deposition * Differential substrate charging With new chapters on dusty plasmas and the kinetic theory of discharges, graduate students and researchers in the field of plasma processing should find this new edition more valuable than ever.

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Principles of Plasma Discharges and Materials Processing , 2nd Edition by Michael A. Lieberman (2005-04-14)

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Principles of Plasma Discharge for Materials Processing by Michael A. Lieberman (1994-11-29)

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