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Kiyokazu Yasuda Edit Profile

educator engineering educator

Kiyokazu Yasuda, Japanese engineering educator. Achievements include patents for joining method of electrodes and assembly method of semiconductor devices; first to introduce electronics packaging technology using self organization; research in measurement of micro nano wetting in materials science and engineering.

Education

Bachelor of Engineering, Osaka University, Suita, Japan, 1986; Master of Engineering, Osaka University, Suita, Japan, 1988; Doctor of Philosophy in Engineering, Osaka University, Suita, Japan, 2001.

Achievements

  • patents for joining method of electrodes and assembly method of semiconductor devices

  • first to introduce electronics packaging technology using self organization

  • research in measurement of micro nano wetting in materials science and engineering

Interests

  • Swimming

Connections

Father:
Keizou

Mother:
Tsuruko

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Education

Career

Awards

  • Best Paper award

    Japan Welding Society, 2003

  • Best Paper award

    Institute of Electrical and Electronics Engineers, CPMT, 2006

  • ICEP Outstanding Tech. Paper award

    Japan Institute Electronics Packaging, 2004