Background
Radhakrishnan, M.K. was born on December 17, 1952 in Vazhoor, Kerala, India. Arrived in singapore, 1991. Son of S. and K.S. (Devaki Amma) Kesavan Nair.
(Failure analysis and reliability improvement are linked f...)
Failure analysis and reliability improvement are linked for improvement of microcircuits packaging by these technical papers. Design factors such as oxide reliability, electromigration and die metallization are considered in testing, and analytic approaches to improved reliability.
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Radhakrishnan, M.K. was born on December 17, 1952 in Vazhoor, Kerala, India. Arrived in singapore, 1991. Son of S. and K.S. (Devaki Amma) Kesavan Nair.
Bachelor of Science, University Kerala, 1972. Master of Science, Sardar Patel University, India, 1975. Doctor of Philosophy, Cochin University, India, 1981.
Device engineer, Keltron Semiconductors, Trichur, India, 1982-1985;
scientist-in-charge failure analysis, Indian Space Research Organisation, Trivandrum, India, 1985-1991;
senior device engineer, Société Générale de Surveillance-Thomson, Singapore, 1991-1993;
member technical staff, Institute Microelectronics, Singapore, since 1993. Technical program chairman Institute of Electrical and Electronics Engineers/International Symposium on Physicians and Failure Analysis of Integrated Circuits Symposium, Singapore, 1995, 97. Consultant International Telecomm.
Union, Geneva/Component Approval Center Telecom, India, 1995, 97, Penang Electronics Manufacturers Association, Penang, Malaysia, 1994. Visiting professor National U. Singapore, 1996.
(Failure analysis and reliability improvement are linked f...)
Institute of Electrical and Electronics Engineers (senior ), Electrostatic Discharge Association.
Married Nirmala Paul, May 21, 1985. 1 child, Balu Radhakrishnan Nirmal.