Background
Engel, Peter Andras was born on July 10, 1935 in Kosice, Slovakia. Came to the United States, 1957. Son of Geza Engel and Herta (Reisz) Engel Koch.
- Photos
- Works
- Photos
- Works
book
Impact Wear of Materials (Tribology)
(Impact Wear of Materials is entirely devoted to quantitat...)
Impact Wear of Materials is entirely devoted to quantitative treatment of various forms of wear occurring in impact-loaded mechanical components. Impact wear is classified under two headings, namely 'erosive' and 'percussive' wear. In erosive wear, particle streams and liquid jets are discussed. The subject is developed with emphasis on material relations, stress analysis and the historical progress of research. In percussive wear, a wide variety of wear mechanisms is described. The author's experimental/analytical work created the groundwork for a general procedure of impact wear-law formulation, combining impact analysis with the physical wear mechanism. Ballistic impact and pivotal hammering, compound impact, the optimal wearpath, lubrication, plasticity, and flexible media are some of the topics considered. The book develops a new conceptual approach to impact, impact-originated wear and wear in general. It describes and utilizes the modern tools of observation in wear science. In mechanical analysis it emphasizes quantitative treatment, using such tools as finite element stress analysis, APL programming language etc., each applied with classic simplicity.
http://www.amazon.com/gp/product/0444415335/?tag=2022091-20
Structural Analysis of Printed Circuit Board Systems (Mechanical Engineering Series)
(This book discusses the building blocks of electronic cir...)
This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction? What are the elastic parameters that determine whether a component will survive a certain acceleration? After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards.
http://www.amazon.com/gp/product/0387979395/?tag=2022091-20
Structural Analysis of Printed Circuit Board Systems (Mechanical Engineering Series)
(This book discusses the building blocks of electronic cir...)
This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction? What are the elastic parameters that determine whether a component will survive a certain acceleration? After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards.
http://www.amazon.com/gp/product/1461269458/?tag=2022091-20
Peter Andras Engel
Edit ProfileMechanical engineering educator
Peter Andras Engel, American mechanical engineering educator. Registered professional engineer, New York. Recipient A.J. Dyer Junior Memorial award American Society of Civil Engineers, 1958. Fellow American Society of Mechanical Engineers (executive board, Charles Russ Richards Memorial award 1983); member Institute of Electrical and Electronics Engineers (senior ), American Academy Mechanics, International Electronics Packaging Society.
Education
Student, Budapest Institute of Technology, 1956. Bachelor of Science, Vanderbilt University, 1958. Master of Science, Lehigh University, 1960.
Doctor of Philosophy, Cornell University, 1968.
Career
Structural engineer, Nashville Bridge Company, 1957-1958;
structural analyst, Praeger-Kavanagh-Waterbury Engineering, New York City, 1958-1962;
research engineer, The Boeing Company, New Orleans, 1962-1965;
staff engineer, International Business Machines Corporation, Edicott, New York, 1968-1971;
advisory engineer, EBM, Endicott, New York, 1971-1983;
senior engineer, EBM, Endicott, New York, 1983-1989;
professor mechanic engineering, Binghamton (New York) U., since 1989. Consultant in field, Bighamton, since 1989.
Achievements
Works
book
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Structural Analysis of Printed Circuit Board Systems (Mechanical Engineering Series)
(This book discusses the building blocks of electronic cir...)
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Structural Analysis of Printed Circuit Board Systems (Mechanical Engineering Series)
(This book discusses the building blocks of electronic cir...)
-
Impact Wear of Materials (Tribology)
(Impact Wear of Materials is entirely devoted to quantitat...)
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Structural Analysis of Printed Circuit Board Systems (Mechanical Engineering Series)
Membership
Fellow American Society of Mechanical Engineers (executive board, Charles Russ Richards Memorial award 1983). Member Institute of Electrical and Electronics Engineers (senior ), American Academy Mechanics, International Electronics Packaging Society.
Interests
Connections
Married Faina Ginzburg. Children: Gregory, David.
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Born
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Died
September 22, 1996 (aged 61) -
Resting place
Binghamton, New York, United States -
Nationality
American -
Religion
Judaism