Background
Lee, Lieng-Huang was born on November 6, 1924 in Fuzhou, Fujian, China. Son of Bin and Da-Mei (Chang) Lee. came to the United States, 1952, naturalized, 1964.
educator consultant research chemist
Lee, Lieng-Huang was born on November 6, 1924 in Fuzhou, Fujian, China. Son of Bin and Da-Mei (Chang) Lee. came to the United States, 1952, naturalized, 1964.
Bachelor of Science in Chemistry, Amoy (Xiamen, Fujian) U., 1947; Master of Science in Chemistry, Case Institute Technology, 1954; Doctor of Philosophy in Chemistry, Case Institute Technology, 1955.
Junior chemist, Nantou (Taiwan) Sugar Factory, 1947-1949;
assistant research chemist, Chia-Yee (Taiwan) Solvents Works, 1949-1951;
assistant research chemist, Rain Stimulation Research Institute, Taipei, Taiwan, 1951-1952;
research associate, Case Institute Technology, Cleveland, 1955-1956;
lecturer, Tunghai U., Taichung, Taiwan, 1956-1957;
consultant to director, Union Industrial Research Institute, Hsin-Chu, Taiwan, 1957-1958;
research organic chemist, Dow Chemical Company, Midland, Michigan, 1958-1963;
senior research chemist, Dow Chemical Company, Midland, Michigan, 1963-1968;
senior scientist, Xerox Corporation, Rochester, New York, 1968-1994;
instructor, chairman course on fundamentals of adhesion, State University of New York, New Paltz, 1981-1996. Visiting professor Taiwan Normal U., Taipei, 1957-1958, Xiamen (China) U., since 1986. Honorary advisor Fujian Light Industries Research Institute, Fuzhou, since 1986.
Honorary professor Chinese Academy Sciences, Lanzhou, since 1997. Consultant TelTech, Minneapolis, since 1994.
Fellow Adhesion Society (Patrick fellow) chairman organic coatings and plastics chemistry division 1976). Member American Chemical Society, American Physical Society, Research Society American (president Midland branch 1965), New York Academy Sciences (trustee and president Xiamen U. American Alumni Association since 1996).
Married Chiu-Bin Wu, February 8, 1949. Children:Muriel Ei-Hui Payne, Daniel Chia-Sen, Robert Min-Sen, Grace Mei-Hui.