Log In

Myung Jin Yim Edit Profile

electronics packaging engineer , researcher

Myung Jin Yim, American electronics packaging engineer, researcher. Recipient 6th Human Tech Thesis award, Samsung Electronics, 2000, Young Researcher award, Korea Research Foundation, 2000, 8th Electronic Component Contest, Korea Electronic Component Association, 2003. Member of Institute of Electrical and Electronics Engineers (associate Outstanding Young Engineer award 2007), American Chemical Society, Surface Mount Technology Association.

Background

Yim, Myung Jin was born on September 5, 1973 in Seoul, Republic of Korea. Son of Jaeduk and Gumbun (Lee) Yim.

Education

Bachelor's, Korea Advanced Institute of Science and Technology, Taejon, 1995. Master's, Korea Advanced Institute of Science and Technology, Taejon, 1997. Doctor of Philosophy, Korea Advanced Institute of Science and Technology, Taejon, 2001.

Career

Research assistant Korea Advanced Institute of Science and Technology, 1995—2001. Visiting research engineer LG Cable Research Center, Anyang, 1997. Visiting research student Packaging Research Center, GeorgiaTech, Atlanta, 1999.

Visiting research scientist International Business Machines Corporation T. J. Watson Research Center, Yorktown Heights, New York, 2000—2001. Senior manager, principal researcher Telephus, Inc., Taejon, 2001—2004. Postdoctoral research fellow Korea Advanced Institute of Science and Technology, 2004—2005, Georgia Institute of Technology, Atlanta, 2006—2007.

Senior packaging material engineer Intel Corporation, Chandler, Arizona, since 2007.

Achievements

  • Achievements include patents for anisotropic conductive film/adhesive of low-resistance/high-current carrying capacity for high-power module application. Patents for manufacturing method for anisotropic conductive adhesive for flip chip interconnection on an organic substrates. Patents for fabrication method of wafer level flip chip package using pre-coated anisotropic conductive adhesives.

    Patents for methods for forming flip chip bump and UBM for high speed copper interconnect chip using electroless plating method. Patents for conductive adhesives for high frequency flip chip interconnects. Patents for bump system for conductive polymer flip chip interconnection using electroless plating method.

    Patents for high reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same. Patents for high adhesion triple layered anisotropic conductive film. Patents for anisotropic conductive film for fine pitch chip-on-glass (Council of Governments) technology application.

    Patents for anisotropic conductive adhesives having enhanced viscosity and bonding methods and integrated circuit packaging using the same. Patents for multilayered anisotropic conductive adhesive for fine pitch. Patents for others.

Works

  • Other Work

    • Contributor articles public to professional journal.

Membership

Member of Institute of Electrical and Electronics Engineers (associate Outstanding Young Engineer award 2007), American Chemical Society, Surface Mount Technology Association.

Interests

  • Other Interests

    Swimming, tennis, drawing, travel, basketball.

Connections

Married Hannah Jung; 1 child Daniel Minjoon.

father:
Jaeduk Yim

mother:
Gumbun (Lee) Yim

spouse:
Hannah Jung

child:
Daniel Minjoon Yim