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Sakuma Katsuyuki Edit Profile

research scientist

Sakuma Katsuyuki, Japanese research scientist. Achievements include research in high-density, low-volume solder interconnections, system-on-package, wafer-level packaging, and 3D integration technologies.

Background

Katsuyuki, Sakuma was born on February 10, 1975 in Yokohama, Japan. Son of Sakuma Noriyuki and Sakuma Noriko.

Education

Bachelor of Science, Tohoku University, Sendai, Japan, 1998. Master of Science in Mechanical Engineering, Tohoku University, Sendai, Japan, 2000. Doctor of Philosophy, Waseda University, Tokyo, 2009.

Career

Intern Halo LSI Inc., Wappingers Falls, New York, 1998. Research staff member International Business Machines Corporation Research Tokyo, Yamato, Japan, since 2000, International Business Machines Corporation T.J. Watson Research Center, Yorktown Heights, New York, 2006.

Achievements

  • Achievements include research in high-density, low-volume solder interconnections, system-on-package, wafer-level packaging, and 3D integration technologies.

Works

  • Other Work

    • Contributor articles to professional journals.

Membership

Member of Institute of Electrical and Electronics Engineers, Japan Society Applied Physics (Appreciation award 2007), Japan Institute Electronics Packaging, Institute Electronics Information & Communication Engineers (associate editor 2003-2005).

Connections

Married Sakuma Ogata. Children: Sakuma, Hiroyuki, Ayaka.

father:
Sakuma Noriyuki

mother:
Sakuma Noriko

spouse:
Sakuma Ogata

child:
Sakuma Katsuyuki

child:
Hiroyuki Katsuyuki

child:
Ayaka Katsuyuki